14th
International Conference
on the Technology of Plasticity
Congress Center | Mandelieu - La Napoule | Bay of Cannes | France
SEPTEMBER 24-29, 2023

Committees

ICTP 2023 Chairs


Pierre-Olivier Bouchard

Mines Paris I PSL Research University- CEMEF 

Katia Mocellin

Mines Paris I PSL Research University- CEMEF 


Régis Bigot

Arts et Metiers Institute of Technology - LCFC


Tudor Balan

Arts et Metiers Institute of Technology - LCFC

ICTP Standing Advisory Board

  • Julian Allwood, University of Cambridge (UK)
  • Tudor Balan, Arts et Métiers ParisTech (France)
  • Pierre-Olivier Bouchard, Mines ParisTech (France)
  • Jian Cao, Northwestern University (USA)
  • Yvan Chastel, Renault (France)
  • Glenn Daehn, The Ohio State University (USA)
  • Peter Groche, TU Darmstadt (Germany)
  • Gerhard Hirt, RWTH Aachen (Germany)
  • Hoon Huh, Korea Advanced Institute of Science and Technology (Korea)
  • Takashi Ishikawa, Nagoya University (Japan)
  • Chung Gil Kang, Pusan National University (Korea)
  • Manabu Kiuchi, Teikyo Heisei University (Japan)
  • Jian-Jun (J-J) Li, Huazhong University of Science and Technology (China)
  • Jeong Whan Yoon, Korean Advanced Institute of Science and Technology (Korea)
  • Martins Paulo, University of Lisbon (Portugal)
  • Marion Merklein, Universität Erlangen-Nürnberg (Germany)
  • Ken-ichiro Mori, Toyohashi University of Technology (Japan)
  • Yuan Shijian, Harbin Institute of Technology (China)
  • Rajiv Shivpuri, The Ohio State University (USA)
  • Erman Tekkaya, Technische Universität Dortmund (Germany)
  • Hiroshi Utsunomiya, Osaka University (Japan)
  • Jun Yanagimoto, University of Tokyo (Japan)
     

    ICTP 2023 Scientific Committee

  • Tatsuhiko Aizawa, Shibaura Institute of Technology (Japan)
  • Julian Allwood, University of Cambridge (UK)
  • José Alves, Transvalor (France)
  • Birgit Awiszus, TU Chemnitz (Germany)
  • Tudor Balan, Arts et Metiers Institute of Technology (France)
  • Pascale Balland, Université Savoie Mont Blanc (France)
  • Dorel Banabic, Technical University of Cluj-Napoca (Romania)
  • Frédéric Barlat, Pohang University of Science and Technology (Korea)
  • Mihaela Banu, University of Michigan (USA)
  • Francois Bay, Mines Paris PSL Research University (France)
  • Niels Bay, Technical University of Denmark (Denmark)
  • Bernd-Arno Behrens, Leibniz Universität Hannover (Germany)
  • Noomane Ben Khalifa, Leuphana University of Lüneburg and Helmholtz-Zentrum Hereon (Germany)
  • Yan Beygelzimer, National Academy of Sciences of Ukraine (Ukraine)
  • Regis Bigot, Arts et Metiers Institute of Technology (France)
  • Christophe Binetruy, Ecole Centrale de Nantes (France)
  • Pierre-Olivier Bouchard, Mines Paris PSL Research University (France)
  • Jose Divo Bressan, Universidade do Estado de Santa Catarina (Brazil)
  • Alexander Brosius, Technische Universität Dresden (Germany)
  • Stefania Bruschi, University of Padova (Italy)
  • Jian Cao, Northwestern University (USA)
  • Jianguo Cao, University of Science and Technology Beijing (China)
  • Oana Cazacu, University of Florida (USA)
  • Diego Celentano, Pontificia Universidad Católica de Chile (Chile)
  • Elisabetta Ceretti, University of Brescia (Italy)
  • Jose Cesar de Sa, University of Porto (Portugal)
  • Yvan Chastel, Renault (France)
  • Francisco Chinesta, Arts et Métiers ParisTech (France)
  • Sam Coppieters, KU Leuven (Belgium)
  • Elías Cueto, University of Zaragoza (Spain)
  • Glenn Daehn, The Ohio State University (USA)
  • Prashant P. Date, Indian Institute of Technology Bombay (India)
  • Laurent Dubar, Université Polytechnique Hauts-de-France (France)
  • Joost Duflou, KU Leuven (Belgium)
  • Luigino Filice, University of Calabria (Italy)
  • Livan Fratini, Università degli Studi di Palermo (Italy)
  • Ming Wang Fu, Hong Kong Polytechnic University (China)
  • Lander Galdos, Mondragon Unibertsitatea (Spain)
  • Andrea Ghiotti, University of Padova (Italy)
  • Sergey Golovashchenko, Oakland University (USA)
  • Okan Görtan, Hacettepe University (Turkey)
  • Peter Groche, TU Darmstadt (Germany)
  • Jinjin Ha, University of New Hampshire (USA)
  • Anne-Marie Habraken, Université de Liège (Belgium)
  • Takayuki Hama, Kyoto University (Japan)
  • Nahiene Hamila, Institut de Recherche Dupuy De Lôme (France)
  • Gerhard Hirt, RWTH Aachen (Germany)
  • Peter Hodgson, Deakin University (Australia)
  • Werner Homberg, Paderborn University (Germany)
  • Sung-Tae Hong, University of Ulsan (Korea)
  • Odd Sture Hopperstad, Norwegian University of Science and Technology (Norway)
  • Yan Huang, Brunel University London (U.K.)
  • Hoon Huh, Korea Advanced Institute of Science and Technology (Korea)
  • Y.T. Im, Korea Advanced Institute of Science and Technology (Korea)
  • Takashi Ishikawa, Nagoya University (Japan)
  • Shohei Kajikawa, The University of Electro-Communications (Japan)
  • Celalettin Karadogan, Universität Stuttgart (Germany)
  • Brad Kinsey, University of New Hampshire (USA)
  • Yannis Korkolis, Ohio State University (USA)
  • Takashi Kuboki, The University of Electro-communications (Japan)
  • Toshihiko Kuwabara, Tokyo University of Agriculture and Technology (Japan)
  • Carl Labergère, Université Technologique de Troyes (France)
  • Myoung-Gyu Lee, Seoul National University (Korea)
  • Xavier Lemoine, Arcelor Mittal (France)
  • Da Yong (D-Y) Li, Shanghai Jiaotong University (China)
  • Heng Li, Northwestern Polytechnical University (China)
  • Mathias Liewald, Universität Stuttgart (Germany)
  • Jianguo Lin, Imperial College (UK)
  • Lars-Erik Lindgren, Luleå University of Technology (Sweden)
  • Hui Long, The University of Sheffield (UK)
  • Yanshan Lou, Xi'an Jiao Tong University (China)
  • Evripides Loukaides, Bath University (UK)
  • Lukasz Madej, AGH University (Poland)
  • Lionel Marcin, Safran Group (France)
  • Paulo Martins, University of Lisbon (Portugal)
  • Marion Martiny, Université de Lorraine (France)
  • Elisabeth Massoni, Mines Paris PSL Research University (France)
  • Ryo Matsumoto, Osaka University (Japan)
  • Takashi Matsuno, Tottori University (Japan)
  • Marion Merklein, Universität Erlangen-Nürnberg (Germany)
  • Junying Min, Tongji University (China)
  • Wojciech Misiolek, Lehigh University (USA)
  • Katia Mocellin, Mines Paris PSL Research University (France)
  • Pierre Montmitonnet, Mines Paris PSL Research University (France)
  • Dirk Mohr, ETH Zurich (Switzerland)
  • Y.H. Moon, Pusan National University (Korea)
  • Chris Nielsen, Technical University of Denmark (Denmark)
  • Gracious Ngaile, North Carolina State University (USA)
  • Masaaki Otsu, University of Fukui (Japan)
  • Hengan Ou, University of Nottingham (UK)
  • Aleksandr Pesin, Magnitogorsk State Technical University (Russia)
  • Jean-Philippe Ponthot, University of Liege (Belgium)
  • Warren Poole, The University of British Columbia (Canada)
  • Benoit Revil-Baudard, University of Florida (USA)
  • Alexandre Rocha da Silva, Federal University of Rio Grande do Sul (Brazil)
  • Andrzej Rosochowski, University of Strathclyde Glasgow (UK)
  • Javier Signorelli, Instituto de Fisica Rosario, Argentina
  • Beatriz Silva, Tecnico Lisboa (Portugal)
  • Andreas Sterzing, Fraunhofer IWU (Germany)
  • Erman Tekkaya, Technische Universität Dortmund (Germany)
  • Sandrine Thuillier, Université de Bretagne Sud (France)
  • Sébastien Thibaud, FEMTO-ST Institute (France)
  • Hiroshi Utsunomiya, Osaka University (Japan)
  • Ton van den Boogaard, University of Twente (Netherlands)
  • Wolfram Volk, Technical University of Munich (Germany)
  • Zhigang Wang, Gifu University (Japan)
  • Michael Worswick, University of Waterloo (Canada)
  • Jun Yanagimoto, University of Tokyo (Japan)
  • Dong-Yol Yang, Gwangju Institute of Science and Technology (Korea)
  • Jeong Yoon, Korea Advanced Institute of Science and Technology (Korea)
  • Yoshinori Yoshida, Gifu University (Japan)
  • Shi-Hong Zhang, Chinese Academy of Sciences (China)
  • Gwoqun Zhao, Shandong University (China)
  • Zhenshan Cui, Shanghai Jiao Tong University (China)

JSTP
Awards

More details

Important
Dates


Standard registration deadline
September 10, 2023

Late fee registration
From September 11, 2023 and on-site

ICTP 2023 Conference
September 24-29, 2023


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